User Manual Q&AAnswer
Feb 24, 2025 - 07:15 AM
To apply thermal grease or paste on an IGBT power module using a stencil, follow these steps:
1. Clean the dirt and residue from the heat sink and stencil using isopropyl or ethylene alcohol.
2. Align the module and stencil by inserting the module into the corresponding holding fixture and placing the stencil on the baseplate.
3. Use a putty knife to apply the thermal compound into the holes of the stencil.
4. Carefully remove the stencil from the baseplate.
5. The resulting print image of the thermal compound on the module baseplate should show an optimum distribution and structure of the thermal paste.
It is important to note that the screen-printing process ensures that the thermal compound is only applied to areas where it is required, resulting in better thermal coupling. This process also provides reproducible application.
For more detailed instructions and visual references, please refer to the "infineon AN2006-02 Apply Thermal Grease in IGBT Modules User Manual" provided by Infineon Technologies AG
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